Wirebonding In Microelectronics
- Editore:
Mcgraw-hill Education - Europe
- EAN:
9780071701013
- ISBN:
007170101X
- Lingua:
- Inglese
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Descrizione Wirebonding In Microelectronics
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates - a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. This title covers wire bonding advances for the era of super-small electronics.
Fuori catalogo - Non ordinabile
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