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Wafer Level 3-D ICs Process Technology
- Editore:
Springer
- Collana:
- Integrated Circuits And Systems
- EAN:
9781441945624
- ISBN:
1441945628
- Pagine:
- 410
- Formato:
- Paperback
- Lingua:
- Inglese
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Descrizione Wafer Level 3-D ICs Process Technology
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
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