RF Measurements of Die and Packages di Scott A. Wartenberg edito da ARTECH HOUSE INC
Alta reperibilità

RF Measurements of Die and Packages

EAN:

9781580532730

ISBN:

158053273X

Pagine:
244
Formato:
Hardback
Lingua:
Inglese
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Descrizione RF Measurements of Die and Packages

The explosion in the wireless industry, coupled with the higher frequencies in today's digital integrated circuits (IC) has made vital the need for accurate IC testing. This is the first book dedicated to the issues surrounding RFIC testing. This ground breaking work enables professionals to perform high-accuracy RF measurements of die and packages in the RF test lab. This timely volume defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.

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