Practical Guide to the Packaging of Electronics
Thermal and Mechanical Design and Analysis, Third Edition
- Editore:
Taylor & Francis Inc
- EAN:
9781498753951
- ISBN:
1498753957
- Pagine:
- 342
- Formato:
- Hardback
- Lingua:
- Inglese
Acquistabile con
o la
Descrizione Practical Guide to the Packaging of Electronics
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides a basic understanding of electronics packaging design issues, updated to reflect recent developments in the field. Early chapters provide a foundation in heat transfer, vibration, and life expectancy calculations. Topics include modes of heat removal; impact of thermal stresses; vibration and stresses; shock management; mechanical, electrical, chemically induced reliability; and more.
Fuori catalogo - Non ordinabile
Recensioni degli utenti
e condividi la tua opinione con gli altri utenti