Direct Bonding

High Quality Content by WIKIPEDIA articles! Direct bonding describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. These requirements are specified for the wafer surface as sufficiently clean, flat and smooth. Otherwise unbonded areas so called voids, i.e. interface bubbles, can occur. Dannoe izdanie predstavlyaet soboj kompilyatsiyu svedenij, nahodyaschihsya v svobodnom dostupe v srede Internet v tselom, i v informatsionnom setevom resurse "Vikipediya" v chastnosti. Sobrannaya po chastotnym zaprosam ukazannoj tematiki, dannaya kompilyatsiya postroena po printsipu podbora blizkih informatsionnyh ssylok, ne imeet samostoyatelnogo syuzheta, ne soderzhit nikakih analiticheskih materialov, vyvodov, otsenok moralnogo, eticheskogo, politicheskogo, religioznogo i mirovozzrencheskogo haraktera v otnoshenii glavnoj tematiki, predstavlyaya soboj isklyuchitelno faktologicheskij material. This book was created using print-on-demand technology.