Adhesion in Microelectronics

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; * Various theories or mechanisms of adhesion * Surface (physical or chemical) characterization of materials as it pertains to adhesion * Surface cleaning as it pertains to adhesion * Ways to improve adhesion * Unraveling of interfacial interactions using an array of pertinent techniques * Characterization of interfaces / interphases * Polymer-polymer adhesion * Metal-polymer adhesion (metallized polymers) * Polymer adhesion to various substrates * Adhesion of thin films * Adhesion of underfills * Adhesion of molding compounds * Adhesion of different dielectric materials * Delamination and reliability issues in packaged devices * Interface mechanics and crack propagation * Adhesion measurement of thin films and coatings